SMD

More than ninety percent of activities connected with the mounting of electronic components are conducted within the automated SMT line. It comprises state-of-the-art computer-operated machines manufactured by leading world producers.

The automated production line is based on three Japanese-made JUKI chip shooters using special nozzles and feeders, as well as laser and vision centering systems, thanks to which they are able to mount components ranging from 0,6 x 0,3 mm (smallest components manufactured in the world) to 150 x 50 mm with a precision of +/-0,08 mm at 3 sigma (laser centering) and +/-0,03 mm at 3 sigma (vision centering), the precision of angle ranging to +/-0,04 degrees at 3 sigma. The minimum lead pitch equals 0,02 mm, whereas the minimum ball pitch is 0,25mm. The maximum output of the machines is 40000 CPH.

Before elements can be mounted, soldering paste is applied onto the boards by means of a computer-operated line stencil printer. Afterwards, when the components are mounted, the board is automatically transported to the German-made ERSA Hotflow resoldering machine. To assure optimum characteristics of solder, boards pass through four separately controlled heating and cooling zones. Depending on the requirements of the technological process, temperature of the heating zones can reach 300 degrees Celsius.

The remaining components, which are not surface mounted, are soldered to the board in the German-made computer-operated ERSA wave soldering plant. This operation allows to shorten production time considerably as it is more than ten times faster than manual soldering and results in greater precision to maintain highest quality and reliability of products.

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